Topological analysis and visualization of interfirm collaboration networks in the electronics industry

摘要

This study examines the topological characteristics of interfirm collaboration networks (CNs) in the global electronics industry. Our results show that high-performing firms exhibit significant relational CN power, manage CNs that follow a power-law shape degree distribution, are predominantly horizontally integrated with low geographic complexity, and maintain a balanced exploration-exploitation collaboration relationship portfolio. We complement our topological analysis with graphical visualizations of each of these CNs over three timeframes (2004-06; 2007-09; 2010-12). Theoretically, we demonstrate the association of topological CN characteristics with high-performance of firms. Methodologically, our study defines and implements a data-driven analyses and visualization of CNs in high clockspeed industries. Our study makes important managerial contributions to the systemic design, engineering, and management of CNs.